NEO Thermal Pad - Thermal Hero Cooling Solutions

NEO Thermal Pad

Overclocking Edition

reliable Cooling

The NEO Thermal Pads – Overclocking Edition are designed specifically for components that operate above standard thermal limits in overclocked systems.

Thermal pads inherently have a higher thermal resistance than thermal paste or liquid metal. For this reason, NEO Thermal Pads are NOT intended for direct CPU or GPU die cooling.

Instead, they are engineered to cool components where:

· paste cannot be applied reliably

· mechanical tolerances vary

· long-term stability is more important than peak benchmark temperatures

Suitable for:

· GPU memory (VRAM)

· M.2 SSDs (NVMe / 2280 standard)

· RAM / system memory modules (DDR4 / DDR5)

· SSD controllers

· Chipsets and auxiliary ICs

This makes NEO Thermal Pads a functional system component, not a universal replacement for paste.

Why Thermal Pads Should Not Be Used on CPUs

Thermal pads:

· have higher thermal resistance

· are designed to bridge gaps, not eliminate them

· work under controlled compression, not direct die pressure

They are not designed to minimize thermal resistance at a bare die interface.

Therefore:

· Not suitable for CPUs, GPU dies, delidded processors

· Ideal for memory modules and secondary heat sources

NEO Thermal Pads – Overclocking Edition are dimensionally stable, electrically non-conductive thermal interface materials developed for memory-intensive and thermally stressed systems.

Technical Benefits

· High thermal conductivity via phase change

· Automatic surface adaptation

· Clean, repeatable performance

· No spreading or dosing required

· Low profile (0.2 mm)

· Electrically non-conductive

How to Choose Your NEO Thermal Pad

[STEP 1] Identify the component

[STEP 2] Select the correct size

[STEP 3] Select the correct thickness

Application	Recommended Size	Recommended Thickness	Notes
M.2 SSD (NVMe, 2280)	80 × 22 mm	0.5 mm (standard) / 1.0 mm (optional)	Designed for direct heatsink contact. Thicker pads not recommended for M.2 slots.
SSD Controller (standalone)	30 × 30 mm	0.5 mm	For compact layouts and tight tolerances.
RAM (DDR4 / DDR5)	80 × 22 mm / 120 × 20 mm	0.5 – 1.0 mm	Optimized for memory heatspreaders and uniform contact.
High-Performance RAM (OC)	50 × 50 mm	1.0 – 1.5 mm	For higher thermal load and slightly larger tolerances.
GPU Memory (VRAM)	50 × 50 mm / 100 × 100 mm	1.0 – 1.5 mm	Cuttable for multiple memory chips; not for GPU die.
GPU Backplate (memory-side)	100 × 100 mm	2.0 – 3.0 mm	Indirect cooling path; thickness depends on gap size.
Custom / Industrial Layouts	100 × 100 mm	2.5 – 3.0 mm	Large tolerances, indirect thermal coupling.

Technical Use Disclaimer

Thermal pads have a higher thermal resistance than thermal paste or liquid metal.
NEO Thermal Pads are not suitable for CPU or GPU die cooling.
They are designed for memory, SSDs, and secondary heat-critical components where gap compensation and long-term stability are required.

Ready to take your Performance to the next level?

Buy Now

Datasheet

SDS

FAQ

Can I use GRAPHENEX without paste or PCM?

No. GRAPHENEX is a heat spreader, not a TIM. Use it in a sandwich with paste or PCM.

Can I use GRAPHENEX without paste or PCM?

No. GRAPHENEX is a heat spreader, not a TIM. Use it in a sandwich with paste or PCM.

Can I use GRAPHENEX without paste or PCM?

No. GRAPHENEX is a heat spreader, not a TIM. Use it in a sandwich with paste or PCM.

Can I use GRAPHENEX without paste or PCM?

No. GRAPHENEX is a heat spreader, not a TIM. Use it in a sandwich with paste or PCM.

FAQ

Can I use GRAPHENEX without paste or PCM?

Can I use GRAPHENEX without paste or PCM?

Can I use GRAPHENEX without paste or PCM?

Can I use GRAPHENEX without paste or PCM?

Buy at available Stores