The Thermal Hero NEO Series Thermal Pads are user-friendly and high thermal conductive (up to 12W/m*k) and low thermal resistant silicon pads.

They have a high cooling performance and with 30 Shore, the NEO Thermal Pads are among the medium soft pads and have a very good compressebility and can fill the irregulations and gaps between the surfaces better than harder Pads, but they are still durable . Due to this soft property, they are easy to process. This feature makes them suitable also for beginners and experts.

It is best suited for applications that require higher cooling performance, such as high-end laptops, graphik cards or gaming consoles, where easy installation and a customizable interface are essential.

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Our THERMAL HERO thermal conductive PAD is developed according to the latest research and findings in the field of thermal management and thermal optimization. The NEO Thermal Pad composes of high-quality polymers and fillers with higher thermal conductivite values.

The material is flexible with good compression ratio to allow better compliance to unevenness to any surfaces.

It can also be easily customized into different shapes and sizes based on the requirements. of the application. Due to its low hardness and high compressibility the thermal pad is perfect for filling even the smallest gaps between component and the heat sink/cooler. Thus, the THERMAL HERO Thermal PAD ensures a constant and optimal heat transfer.

The NEO Thermal Pad is designed with excellent thermal stability, ensuring long-term performance and reliability. The Pads are electrically insulating to prevent any unwanted electrical conductivity or short circuits.

Features & Benefits

  • Efficient and optimal heat transfer
  • Excellent thermal conductivity
  • Environmentally friendly, does not contain any toxic ingredients
  • Good flexibility & compression ratio
  • Flexible and can be easily bent and trim to customized sizes
  • RoHS compliant
  • Safe Handling

NEO Thermal Pad Applications

  • PC peripherals / overclock systems CPU, GPU Laptops, MCM, Mobil Phones
  • LCD Devices and Semiconductors
  • PDP, High power density LED module, IGBT
  • Aerospace, High Tech Audio/Video, 5G module units, Medical Equipments
  • Optical communication Equipment
  • Between any metal and electronic components Heat Transfer.

Additional information

Weight N/A
Dimensions N/A

0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm


100 x 100, 120 x 20, 30 x 30, 50 x 50


1pcs, 2pcs