Thermal Interface Material
is a material used to fill the microscopic gaps between two surfaces (heater and heatsink) in order to improve thermal transfer between them. It is commonly used in electronic devices such as CPUs, GPUs, and power electronics to improve the heat dissipation efficiency. These gaps can inhibit efficient heat transfer and create thermal resistance, resulting in increased operating temperatures and potential performance degradation.
TIMs come in various forms such as thermal pads, thermal paste, and phase change materials. Overall, the choice of TIM depends on the specific application and the heat transfer requirements. A high-performance CPU, for example, may require a TIM with excellent thermal conductivity to ensure optimal cooling. The choice of TIM depends on the application and the heat transfer requirements.